How much can one package take? As consumer electronics design features scale down to 45-nm and even 32-nm nodes, IC makers are pushed to the limits to shoehorn more functionality into these packages- ...
Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...
The IC is a small piece of silicon that needs to be protected from and interfaced to the outside world. This is the role of the package. The package not only protects the semiconductor from mechanical ...
Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...
Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But ...
Linear Technology Corporation and Microbonds have announced successful qualification of Microbonds X-Wire insulated wire bonding technology to enable design flexibility for Linear Technology’s ...
CAMBRIDGE, England--(BUSINESS WIRE)--Cambridge GaN Devices (CGD), the fabless, clean-tech semiconductor company that develops energy-efficient GaN-based power devices that make greener electronics ...
Siemens Digital Industries Software is adopting a new approach for sharing accurate thermal models of IC packages to the electronics supply chain. The main advantages are protecting IP, enhancing ...
Mentor Graphics is bringing together the IC design, package design and PCB layout in a single tool environment. The design environment called Xpedition Package Integrator flow can be used to integrate ...
Solution integrates the Virtuoso platform with Allegro and Sigrity technologies to streamline overall design process and significantly improve productivity and cycle time SAN JOSE, Calif. , May. 30, ...
Flomerics’ Flopack V6.2 is the latest version of its web-based SmartPart library that generates fast, accurate thermal models for IC packages and associated parts. Thermal models created within ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results