webtv.un.org

Independent International Scientific Panel on AI

The Independent International Scientific Panel on Artificial Intelligence has officially released its Preliminary Report. Read the report Watch the Press Conference on the Launch (UN Web TV) ...
techtimes

Intel and TSMC Pile In as Glass Substrates and Panel Packaging Head for 10x Growth

The market for fan-out panel-level packaging (FO-PLP) and glass substrates is set to grow more than tenfold in five years, as Intel, TSMC, and others race to adopt the large-area packaging that ...
Commercial Integrator

Draper Adds Geer Tech To Represent Southern California and Southern Nevada

Geer Tech of Huntington Beach, Calif., will represent the complete line of Draper Pro AV products in southern California & ...

Amazon is designing its own AI chips for Echo, Fire TV and future devices, exec tells CNBC

Amazon hardware chief Panos Panay says the company is designing custom chips for key devices as it experiments with AI ...
on3

Rodriguez and Gill-Howard showcase talent at Texas Tech Pro Day

Nov 15, 2025; Lubbock, Texas, USA; Texas Tech Red Raiders head coach Joey McGuire and wife Debbie celebrate senior day with Texas Tech Red Raiders defensive lineman Skyler Gill-Howard (0) before the ...
techtimes

TSMC Readies Panel-Level Packaging for AI Chips, Setting Up a Showdown With Samsung

TSMC is preparing to mass-produce panel-level packaging (PLP), a next-generation chip-packaging technology — setting up a direct contest with Samsung Electronics, which entered the field earlier.