Google has announced a new open-source rack-mounted, closed-loop liquid-to-air cooling system for use in existing air-cooled ...

For multiple racks of accelerated AI compute fitted with RDHxs, it convenient to add a liquid-to-liquid coolant distribution ...

RUST, Germany, March 26, 2026 /PRNewswire/ -- MiTAC Computing Technology Corporation, a global leader in high-performance and energy-efficient server solutions, and a subsidiary of MiTAC Holdings ...

Designed for OCP compatibility, new in-chassis light engine eliminates faceplate bottleneck, powering up to 51.2 Tbps of optical bandwidth for AI scale-up Lightmatter, the leader in photonic ...

SAN JOSE, Calif., Dec. 9, 2025 /PRNewswire/ -- Super Micro Computer, Inc. (SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, today announced the expansion of its NVIDIA ...

Integrated, modular solutions to address power and density challenges for AI environments will be unveiled at the 2025 OCP Global Summit COLUMBUS, Ohio, Oct. 10, 2025 /PRNewswire/ -- Vertiv (NYSE: VRT ...

The rising difficulty of cooling next-generation, high-performance artificial intelligence (AI) chips with standard air ...

Global computing power is growing aggressively and pushing high-density chip power consumption. As this power density increases, traditional air cooling is reaching its physical limits, and ...

Recent industry announcements highlight a shift towards integrated, scalable cooling solutions driven by AI and HPC demands.

Complementing the 2-OU (OCP) model, the 4U Front I/O HGX B300 Liquid-Cooled System offers the same compute performance in a traditional 19-inch EIA rack form factor for large-scale AI factory ...