Big Fund-invested Piotech plans to acquire Wuxi Shangji and diversify into wafer-bonding, leveraging a big revenue surge to ...

For AI and HPC processors, performance depends not only on transistor density, but also on memory bandwidth, I/O density, ...

TSM expands global 3-nanometer capacity across Taiwan, Arizona and Japan to meet booming AI demand and boost long-term growth ...

Should you invest in the SOXX ETF? Here's what investors should know before allocating capital into this fund.

IICIE Emphasizes semiconductor materials, wafer fabrication equipment, packaging and testing, 2.5D/3D advanced packaging, and ...

Sandisk Corporation (Nasdaq: SNDK) today announced it is sampling its BiCS10 1Tb TLC, its 10th-generation 3D NAND flash memory technology. BiCS10 applies advanced lateral scaling techniques to achieve ...

Kioxia is set to mark a major milestone on Friday with a ceremony at its manufacturing facility in northern Japan as the ...

Elon Musk says IBM’s 0.7-nanometer chip label is misleading and wants chip nodes named by atom-level feature size instead.

The global semiconductor manufacturing equipment market is projected to expand by USD 46.68 billion between 2024 and 2028, ...

Hanmi Semiconductor is expanding its lineup of 2.5D packaging equipment for AI system chips. The move extends the company's ...

While much has been said about advanced packaging in the context of Malaysia's semiconductor sector, little is actually known ...

Intel Corp. has broken ground on an expansion of its Santa Clara, California, facility that will include semiconductor ...