May 25 (Asia Today) --Employees at Taiwanese semiconductor giant TSMC are reportedly growing increasingly frustrated over rumors of layoffs and bonus cuts despite the company posting record ...

Chip giant TSMC is aggressively expanding its advanced 2nm production capacity to meet the unprecedented demand for artificial intelligence (AI) chips and high-performance computing (HPC). The company ...

At its recent North America Technology Symposium, TSMC said it is doubling the pace of advanced-node capacity expansion to meet booming demand for AI and high-performance computing (HPC). Senior Vice ...

TSMC announced three new advanced process technologies at its North America Technology Symposium last week A13, A12 and N2U as part of its latest advanced technology roadmap. Compared to the roadmap ...

Taiwan Semiconductor Manufacturing Co (TSM) on Wednesday launched its newest generation of chip manufacturing ‌technology aimed at creating smaller and faster chips, especially for artificial ...

Use left and right arrow keys to seek audio. TSMC's CapEx (Capital Expenditures) for 2026 is projected to hit $56 billion. This capital is being funneled into a three-pronged effort to address rising ...

More details are emerging about TSMC's massive investment in chip manufacturing on U.S. soil, which now reportedly includes a dozen fabs and four advanced chip packaging plants in Arizona, according ...

TSMC is the world's largest semiconductor (chip) foundry. Instead of making chips for general sale that companies can buy in stores or online, semiconductor foundries manufacture the physical chips ...

On Thursday, Taiwan Semiconductor Manufacturing Company (TSMC) reported record fourth-quarter earnings and said it expects AI chip demand to continue for years. During an earnings call, CEO C.C. Wei ...

In the early days of the new year, some (including my colleague Alex Wissner-Gross) are pointing out the solid position (to say the least) of the Taiwan Semiconductor Manufacturing Company or TSMC.

Semiconductor equipment suppliers reveal that TSMC and non-TSMC players, including ASE, Amkor, and UMC, are accelerating the expansion of advanced packaging Chip on Wafer on Substrate (CoWoS) capacity ...